Market Need

There is ever-increasing demand for high performance cooling systems for power electronics. This trend is driven by global electrification and green transition.

The liquid cooling is the only viable solution that can stand against increased heat dissipation challenges of modern chips and components.

The products performing with higher frequency and more efficiently must have superior cooling. This includes automotive inverters where the development of new chips is crucial.

Approach

Our CuWick structure has superior thermal performance in comparison to current aluminum solutions. The best characteristics of aluminum and copper are combined with advanced design. The copper is infused with aluminum to generate 25% less thermal resistance. This enables the use of lower cost solutions with power modules. It gives unique advantage to reach lower costs for inverter manufacturer due to the higher performance compared to traditional aluminum version.

Benefits

CuWick structure is 30% lighter than copper and 25% more efficient than aluminum. This is a game changer in cooling due to a lower thermal resistance. It enables to use lower cost solutions compared to traditional coolers. The harmonized CTE structure between copper power module and cooler is another advantage. The risk of warpage can be minimized due the possibility of joining the modules individually.

Competition

CuWick structure is protected with patent pending. It represents the latest development in power modules. It can handle the heat and conduct it with lower thermal resistance than any other cooler in the market. The structure gives an excellent advantage compared to other solutions and brings the possibility to be more efficient at a lower cost.

Hollmen is very flexible and innovative company constantly improving efficiency and cost effectiveness of cold plates.